PCB Fabrication

Examining the delivered boards

Measurement of track width/pad dia.
Measurement of spacing between tracks/pads.
Hole diameter measurements by using go/no-go tools.
Inspection of defects in PTHs.
Exposed copper; the solder plating should cover it all
Undercut copper on fine features
Copper bridging and/or solder plate bridging between features
Bubbled or cracked solder mask
Poorly (non-uniformly) plated holes
Scratches on the boards due to poor packing/shipping

Capabilities -PCB Design

Schematic Capture and Netlist generation
Designs from single layer to multi-layer PCBs as per IPC / MIL STD
55110F design standards and fabrication requirements
Design of complex Rigid, Rigid-flex, Metal core (embedded heat sink),
Thermal ladder/External heat sink (thermabonded)
Surface mounts, BGA, Micro BGA, Flex BGA and through-hole designs with
blind and buried vias.
Controlled impedance traces.
Differential Pairs/Matched lengths.
High density interconnects (HDI) designs.
Microvias and Vialess routing.
Design of multi chip modules (MCMs), PC Add-on boards, burn-in boards
Split ground planes and power planes for mixed analog and digital designs
High speed design, early analysis and design optimization
Post layout analysis for signal integrity, impedance match
Solutions for EMI/EMC
Thermal Analysis
Reliability Analysis

Capabilities -PCB FAB

Multi Tech has established strategic business alliances with FAB Industries
with approved facilities for the manufacture of MIL grade PCBs of varying
Complexities and materials catering to industrial, defense, avionics and space
Applications.

The PCB Manufacturing capabilities include
High Density Interconnect (HDI)
MIL-P-55110 F
Impedance Control
Blind & Buried Vias
Up to 2 mils trace/space width
Rigid, Flex and Rigid-Flex boards
FR4, FR5, Polyamide, Getek, Rogers, Nelco, Teflon, Kevlar and other materials
PCMCIA
Multichip and multicircuit modules
Full body Gold
Tin/Nickel burn-in boards
Carbon Paste
Metal Core PCBs (embedded heat sink) with Aluminum alloy core /Copper
core/Copper-Invar-Copper core
Thermabonded PCBs (External heat sink)
Special processes like epoxy bonded boards
Up to 32 layers
Manufacturing Expertise & Technology
Impedance Control Boards
Buried and Blind Vias
Polyamide Multilayer
PCMCIA Board
Full Body Gold
Tin/Nickel burn-in boards
Carbon Paste
Thermabonded PCBs
Metal Core PCBs
Sandwich PCB constructed in cassette form with Honey comb heat sink
Upto 22 layers
Netlist clamshell testing
Teflon PCBs